- Design review for manufacturing (DFM), technical risk assessment (TRA) and assembly process flow suggestion for new products from customers
- Trouble shooting for technical or quality problems during NPI procedure
- Direct collaborations and frequent communications with customer counterparts
- New Product Introduction (NPI) of System in Package (SiP) products
- Close collaboration with factory teams for seamless transition from NPI to mass production
- Development of new technologies required for NPI – including process, material, system

- English skill: At least Intermediate level
- Intermediate or higher level of utilization ability for AutoCAD
- Master&039;s degree in material, mechanical, chemical, electrical engineering or equivalent if Fresher candidate.
- Bachelor&039;s degree in material, mechanical, chemical, electrical engineering or equivalent and having at least 1- 2 years as R&D Engineer for Semiconductor package product or assembly process for System in Package (SiP)
- No barrier to working abroad for a short time in South Korea or the other company World Wide sites

Chế độ bảo hiểm, Du Lịch, Chế độ thưởng, Chăm sóc sức khỏe, Đào tạo, Tăng lương

Cập nhật gần nhất lúc: 2024-08-12 14:40:02